A liquid crystal based contact lens display using PEDOT: PSS and obliquely evaporated SiO2

An active spherically conformed liquid crystal cell is presented comprising PEDOT:PSS as a transparent conductive layer and obliquely evaporated SiO2 as an alignment layer. To tackle compatibility issues with the SU8 processing needed for the spacers, an additional buffer layer was included in the fabrication process. The electro-optic response is inspected closely and a contrast measurement is given

A biocompatible active artificial iris

A contact lens mimicking an artificial iris is presented as solution for people suffering from iris deficiencies. As this is a biomedical device, biocompatibility is a key specification for material choice and design. The presented research focusses on oxygen permeability of the lens, as the eye depends on oxygen from the environment for functioning

A contact lens with built-in display: science fiction or not?

Recent progress in microsystems integration technology such as ultra-thin chip packaging, stretchable interconnections, thin-film batteries and organic photovoltaics makes it feasible to incorporate various electronic components and transducers in extremely confined spaces and inside flexible or conformable objects. Can this ultimately lead to a genuine display in a contact lens? The major outstanding issues are reviewed

VAN LCOS microdisplays: a decade of technological evolution

Abstract—Microdisplays of the liquid crystals on silicon (LCOS) type have gone through a rapid evolution during the last decade. We present an overview of how vertically aligned nematic (VAN) LCOS have evolved from an attractive, but notoriously difficult and even infamous technology, to the mainstream microdisplay technology that it is today. At the same time, we highlight a number of remaining issues and concerns, and present some ideas of how to remedy them

Electronic compensation for fringe-field effects in VAN LCOS microdisplays

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Free-form 2.5D thermoplastic circuits using one-time stretchable interconnections

A technology is presented for the production of soft and rigid circuits with an arbitrary 2.5D fixed shape. The base of this technology is our proprietary technology for elastic circuits with a random shape, in which the elastic thermoset (mostly PDMS) polymer is now replaced by soft or rigid thermoplastic variants. An additional thermoforming step is required to transform the circuit from its initial flat to its final fixed 2.5D shape, but for rigid fixed shape circuits only one-time stretchability of the extensible interconnects is required, relieving the reliability requirements